14.06.2013 spd64 -0 2 1 of 2 s pd 64- 0 2 technical data silicone pd , 5 mm package spd 64- 0 2 is a pin - photodiode containing a chip with 0.8 x 0.8 mm active area, mounted into on a lead frame with a clear epoxy lens. this device is featuring excellent responsibility of 10ns and a high pho tocurrent. it?s designed to be easy of setting up optically with a wide angle of half sens itivity of 1 5 de grees. specifications (unit: mm) ? spectral responsivity (peak) : 900 nm ? chip size : 1.0 x 1.0 mm ? active area : 0.8 x 0.8 mm ? package: 5mm molding t ype : lead frame resin material : epoxy resin absolute maximum ratings (t a =25c) item symbol value unit reverse breakdown voltage v (br)r 170 v operating temperature t opr - 25 ? +100 c storage temperature t stg - 30 ? +125 c soldering temperature * 1 t sol 2 40 c * 1 mus t be completed within 3 seconds at 240c electro - optical characteristics item symbol condition min. typ. max. unit reverse photo current i l v r =10v, l=1000lx - 2 0 - a reverse dark current i d v r =10v - 1 0 na open c ircuit voltage v oc v r =10v, l=1000lx - 41 0 - mv spectral responsivity (peak) p - 900 - nm half angle of sensitivity 1/2 1 5 - deg total capacitance c t v r =10v, f=1mhz - 6 - pf rise time (10 - 90%) t r r l =1k , v r =10v - 1 0 - ns fall time (10 - 90%) t f - 1 0 - ns note: the above specifications are for reference purpose only and subjected to change without prior notice.
14.06.2013 spd64 -0 2 2 of 2 precaution for use 1. lead forming ? lead forming should be done before soldering. ? when forming leads, the leads should be bent at a point at least 3 mm from the base of the lead. do not use the base of the lead frame as a fulcrum during lead forming! ? do not apply any bending stress to the base of the lead. the stress to the base may damage the p d?s characteristics or it may break the p ds. ? when mounted the p ds onto the printed circuit board, the holes on the circuit board should be exactly aligned with the leads of p ds. if the p ds are mounted with stress at the leads, it causes deterioration of the lead and it will degrade the p ds. recommended land layout (unit: mm) 2. soldering conditions ? solder the pd s no closer than 3 mm from the base of the lead. ? do not apply any stress to the lead particularly when heat. ? after soldering the pd s, the lead should be protected from mechanical shock or vibration until the p d s return to room temperature. ? the p ds must not be reposition after soldering. ? when it is necessary to clamp the p ds to prevent soldering failure, it is important to minimize the mechanical stress on the p ds. ? cut the p d leads at room temperature. cutting t he leads at high temperature may cause the failure of the p ds. soldering conditions 3. static electricity ? the p ds are very sensitive to static electricity and surge voltage. so it is recommended that a wrist band and/or an anti - electrostatic glove be used when handling the p ds. ? all devices, equipment and machinery must be grounded properly. it is recommended that precautions should be taken against surge voltage to the equipment that mounts the p ds .
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